Cooler Master in Telecommunications
5G Evolution becomes Reality
The new era of AI and IoT is coming. It is all about interactions and communications – machines to machines, machines to human, human to machines – all supported by 5G, the 5th generation mobile networks. Rather than just increasing data rates and expanding coverage like previous generations did, ambitious 5G will make connected societies possible and revolutionize the way that wireless networks are built, interacted, and operated.
Starting from 2017, critical standards and ecosystems like new radio (NR), RAN architecture, Massive MIMO, virtualization of core networks are all taking shape. Thermal management requirement is also getting more clear and strict. Using Massive MIMO and the large-scale antenna array can bring huge gains in spectral efficiency and enable to serve many more devices. However, it also adds up huge heat dissipation while integrated into radio unit. A recent study shows, the 64 antenna array may generate heat up to 600W when it is running at 38GH, and without proper cooling, the temperature will reach 200’C or even higher, and the system likely melts down. The thermal management becomes extremely critical.
Cooler Master enables Transformation
Cooler Master has been dedicated to Telecommunication applications since the 3G industry boomed out in 2010. We continue expanding cooling solutions to relentlessly address the needs of our customers through joint development at the early stage. Following the evolution from 3G, 4G, 4.5G to upcoming 5G, we provide a line-up of projects and technologies for various outdoor and indoor sub-applications including Radio Unit, Baseband Unit, Cabinet & Enclosure, and Backhaul Optical Module:
Taking into considerations key factors including thermal performance, outdoor requirements, weight and cost-effectiveness, Cooler Master provides total thermal solutions for frame heat sinks, PA plates and modules, and combinations of both. As new standards emerge like antenna arrays integrated into the radio access, we are ready to provide thermal fin heat sinks as enhanced natural convection cooling solution to significantly improve heat dissipation efficiency.
Both indoor and outdoor baseband units are required to be more compact while the chipsets and FPGAs evolve toward higher power density. Cooler Master provides total heat sink solutions embedded with Heat Pipe or Vapor Chambers to meet surging thermal requirements. At the join-design stage, we take into account overall forced convection environment to proactively propose to our customers for optimal design.
Cabinet & Enclosure
Water and dust proofing, as well as easy maintenance, become crucial in addition to thermal performance for customers to design and choose appropriate cooling solutions at first place especially for the installation at harsh or even extreme environments. On top of direct air cooling, Cooler Master re-shape conventional technologies in automotive segment to customize Heat Exchangers (Thermosiphons) of different thermal capacities to meet various needs.
Backhaul Optical module
To ensure the performance and reliability of the optical transceiver module amid multiple interconnects, Cooler Master invested in an ultra-high precision machining-centric production line equipped with Helium leak test equipment. In parallel, we are developing advanced cooling solutions for next-gen optical modules which require less strict vacuum hermetic level but much higher power density generated by laser diodes.